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Ceramic Polishing Plate and Ring

Ceramic Plates (also known as Wafer Carrier Plates) could be used for CMP dicing, lapping, polishing and thinning of 3, 4, 5, 6 ,8 inches semiconductor wafers. It has advantages such as high flatness and parallelism, compact and uniform microstructure, and high cost performance.

•Good Chemical stability, high abrasion resistance and corrosion stability
•fast heat transmission
•high flatness and no deformation
•no pores, scratches and cracks